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Intel¢ç TXN17401 10Gbps XENPAK MSA
µî·ÏÀÏ : 2016-08-16
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¸ðµ¨¸í : Intel¢ç TXN17401 10Gbps XENPAK MSA
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¸ðµ¨(Á¦Ç°¸í) Intel¢ç TXN17401 10Gbps XENPAK MSA
Á¦Ç°»ç¾ç The Intel¢ç TXN174XX 10Gbps Serializer/ Deserializer (SerDes) XENPAK transceiver is designed to provide an IEEE802.3ae, draft 4.0-compliant 10.3Gbps interface between
the photonic physical layer and the electrical section layer. The module is comprised of an optical transmitter and receiver pair integrated with Attachment Unit
Interface (XAUI)-to-serial conversion. The TXN174XX includes Physical Coding Sublayer (PCS), Physical Medium Attachment (PMA), and Physical Medium Dependent (PMD) functions. The transmitter section decodes
four 8B10B encoded channels at 3125 Mbps from a XAUI parallel data bus, performs 64B/66B scrambling, and multiplexes the result into a 10.312 Gbps optical signal
launched into a single-mode optical fiber pigtail.
he receiver section demultiplexes a single 10.3125Gbps optical signal and converts it to four channels of 3125Mbps XAUI. The receiver includes a photodiode,
transimpedance amplifier, clock recovery, decision circuit and demultiplexer, and operates over both the 1.3¥ìm and 1.5¥ìm bands.
The transponder is assembled in a Multi-Source Agreement (MSA)-compatible package (4.8 inches long, 1.4 inches wide, and 0.7 inches high). The heat sinking was
designed for 50¡ÆC ambient temperature with 200 linear feet per minute airflow. The electrical interface is through a XENPAK MSA-compliant 70-pin board edge
connector, with optical connections made using standard SC-UPC optical connectors.The 10GBASE-LR transceiver is intended for link spans up to 10km, and uses a 1.3¥ìm Distributed Feedback (DFB) laser source. An IEEE802.3ae and XENPAK MSA
compliant Management Data Interface (MDIO) is also included.
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